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DFX中的先进焊接技术

开课日期:2019年10月18-19日

开课地址:苏州

报名电话:0755-26401545

主讲老师:李宁成博士

DFX中的先进焊接技术
主办单位:深圳市意盛波资讯有限公司
课程前言:
本课程涵盖了DFX的原则,参加者通过学习先进焊接技术的处理,可以很快速度提高产品的成品率以及可靠性,针对允许课程者最大限度地提高制造成品率和可靠性,输出先进焊接技术在处理。此课程内容注重SMT制造的可靠性设计过程,每个设计的考虑是以一个真实的案例来研究,本课程致力于丰富的案例研究来详细的分析现在最热门的,但具有挑战性的高级组件封装(POP)和底端部件(BTC)。
This course covers the principles of DFX, aiming at allowing the course taker maximize the output of manufacturing yield and reliability when addressing advanced soldering technology. The content emphasize on Design for Process and Design for Reliability for SMT manufacturing. Each of the design consideration is exemplified with a real case study, with fundamental consideration and mechanisms of challenges well illustrated. Furthermore, this course dedicates abundant case studies and detailed analysis on DFM for the prevailing but challenging advanced components Package-on-Package (PoP) and Bottom-Terminated-Components (BTC).
课程收益:
请过大量的丰富的案例来详述可制造性(DFM)和可靠性设计(DFR)先进的焊接技术及应用设计原则,你将能够在SMT工艺设计和焊接工作中灵活运用DFX,以便很容易实现并达到产品高产量和高可靠性,并准备迎接新的挑战。
With abundant case studies illustrating the principle and application of Design for Manufacturability (DFM) and Design for Reliability (DFR) in advanced soldering technology, you will be able to apply DFX on your SMT design and process of soldering job and achieve high yield and high reliability very easily, and also be ready to face the new challenges emerged.
授课对象
设计工程师,设计主管及总监、工艺工程师、工艺主管、工艺经理及总监、可靠性工程师,研发部、质量部,材料科学家,管理人员,凡在无铅焊接成功的制造感兴趣,并达到较高的可靠性的人员。
Design Engineer, design director and director, process engineers, process manager, process manager and director, reliability engineer,, R & D department, quality, materials scientists, managers, where in the lead-free welding manufacturing interested in and achieve high reliability.
本课程将涵盖以下主题:
主题 Topics
Part 1 可制造性设计(DFM原理 Part 1 Design for Manufacturability (DFM) – Principle
Part 2 设计过程 Part 2 Design for Process
产量设计-整理制造环境 Design for Yield  - Tidy up Manufacturing Environment
设计质量-来料可焊性设计 Design for Quality  - Incoming Component Solderability
设计模板 Design Stencil
模板- PCB对准 Stencil - PCB Alignment
设计垫 Design Pad
通孔焊盘设计 Design Through-Hole Pad
通过与微通孔的设计 Design Via &Microvia
通过定位设计 Design Via Location
设计回流曲线 Design Reflow Profile
抑制空洞设计-回流曲线 Design Reflow Profile - for Suppressing Voiding
设计制造过程----降低成本 Design Manufacturing Process - for Cost Reduction
设计铜垫---蚀刻因子 Design Cu Pad - Etching Factor
设计铜垫-通孔膝损失 Design Cu Pad - Through-Hole Knee Loss
设计铜垫厚--板孔的填充 Design Cu Pad - Thick Board Hole Fill
通孔元件的设计 Design Through Hole Component
设计元件定位 Design Component Orientation
设计托盘---选择性焊接 Design Pallet - Selective Soldering
设计焊接掩膜的厚度--表面平整度 Design Solder Mask - Thickness, Surface Smoothness
设计开焊 Design Solder Mask – Opening
设计阻焊膜抑制减少QFN空洞 Design Solder Mask - Suppress Voiding of QFN
设计检查 Design for Inspection
Part 3 可靠性设计(DFR Part 3 Design for Reliability (DFR)
设计组件的位置,避免焊接热休克或处理应力损伤 Design Components Location - Avoid Soldering Thermal Shock or Handling Stress Damage
通过可靠性设计 Design Via for Reliability
可靠性设计---底部组装的组装 Design for Reliability - Assemble Low Standoff Components
可靠性设计----空洞重要吗? Design for Reliability - Does Void Matte
可靠性设计---热变形 Design for Reliability - Battling Thermal Warpage
可靠性设计---防止热变形引起的枕头效应 Design for Reliability - Preventing Thermal Warpage Induced Head-In-Pillow
可靠性设计-防止热变形引起的NOW不润湿开路 Design for Reliability - Preventing Thermal Warpage Induced NWO (Non-Wet   Open)
可靠性设计-防止蠕变腐蚀 Design for Reliability - Preventing Creep Corrosion
可靠性设计---Cu焊盘尺寸的影响 Design for Reliability - Effect of Cu Pad Grain Size
可靠性设计---焊料合金与IMC Design for Reliability - Solder Alloy vs IMC
可靠性设计---避免开裂的内在整合 Design for Reliability - Avoid Intrinsic IMC Cracking
可靠性设计---考虑到合金表面之间的相互作用 Design for Reliability - Consider Interaction between Alloys & Surface Finishes
可靠性设计---热循环可靠性 Design for Reliability - Thermal Cycle Reliability
可靠性设计---脆弱性 Design for Reliability – Fragility
可靠性设计---57bi42sn1ag低温接头脆性 Design for Reliability - Brittleness of Low Temperature Joints Containing 57Bi42Sn1Ag
可靠性设计---消除含Bi-Sn合金低温接头脆性 Design for Reliability - Eliminating Brittleness of Low Temperature Joints Containing Bi-Sn
可靠性设计(在向后兼容系统)--- 回流曲线影响 Design for Reliability (in Backward Compatibility System) - Profile Effect
可靠性设计(在向后兼容系统)--- 空洞规则 Design for Reliability (in Backward Compatibility System) - Voiding Regulation
Part 4  POP设计 Part 4 Design for PoP
PoP的设计:过程高效PoPUnderfilling设计 Design for PoP : Processes - Design for Efficient PoPUnderfilling
PoP的设计:过程--- PoP/CSP各种聚合物加固方法的比较 Design for PoP : Processes - Comparison of Various Polymeric Reinforcement Approaches for PoP/CSP
PoP的设计:质量---对产量和SOP及材料的影响跌落测试性能 Design for PoP : Reliability - Effect of SOP & Material on Yield & Drop Test Performance

PoP的设计:PoP质量--- Materials & Profiles的影响 Design for PoP :PoP Reliability - Effect of Materials & Profiles
PoP的设计:PoP质量---材料的选择及参数优化 Design for PoP :PoP Reliability - Materials Selection & Parameter Optimization
PoP的设计:PoP质量--混合合金 Design for PoP :PoP Reliability - Mixed Alloy
PoP的设计:质量--- 平整度和设计的影响 Design for PoP : Reliability - Effect of Coplanarity and Design
PoP的设计:质量---球的大小,通过规模效应,合金型叠起来的高度可靠性 Design for PoP : Reliability - Effect of Ball Size, Via Size, Alloy Type on Stack-up Height & Reliability
Part 5   BTC(Bottom Terminated Components)的设计 Part 5 Design for BTC (Bottom Terminated Components)
BTC的设计--- BTC的类型及其特点 Design for BTC - - BTC Types & Characteristics
BTC的设计--- 设计过程 Design for BTC - Design Process
BTC的设计---设计质量 Design for BTC - Design Reliability

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