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先进的晶圆级封装技术及其应用

开课日期:2019年8月19-20日

开课地址:苏州

报名电话:0755-26401545

主讲老师:WeiKoh

Advanced Wafer Level Packaging Technology and Applications
先进的晶圆级封装技术及其应用
主办单位:深圳市意盛波资讯有限公司
Forward 前言
    Advanced Semiconductor Technology is the core of Electronics Industry that advances progress in modern high-tech world. For 50 years semiconductor node processing followed Moore’s Law to increase wafer transistor density and reduce manufacturing cost. Now, IC processing has reached the limit of planar node shrinkage and High-Density Advanced Packaging (HDAP) solutions have emerged as solutions to help achieving More-than-Moore goals in 3D IC heterogeneous integration. The focus of HDAP has been in Wafer Level Package (WLP) due to its small form factor, versatile applications to meet the present industry needs and lower manufacturing cost. It is therefore critically essential to keep up with the progress in WLP technology design, materials, process, and applications in order to remain competitive for applications in AI, Big Data, IoT, Smart Manufacturing, Robotics, 5G Communications, and Autonomous Automobiles.
    先进半导体技术是推动现代高科技世界进步的电子行业核心。50年来,半导体节点处理一直遵循摩尔定律,用于增加晶圆晶体管密度以及降低制造成本。现在,集成电路处理已经达到平面节点收缩的极限,同时出现高密度先进封装(HDAP)解决方案,以帮助实现3D集成电路异构集成中的超越摩尔定律目标。由于尺寸较小、用途广泛,并且能够满足当前的行业需求以及制造成本较低,晶圆级封装(WLP)一直是HDAP的重点。因此,为了在人工智能、大数据、物联网、智能制造、机器人、5G通信和自动驾驶汽车领域保持竞争力,我们必须跟上WLP技术设计、材料、工艺和应用的步伐。
Features课程特点
   This course provides a comprehensive review and discussion on the progress of HDAP WLP technology, with emphases on design considerations, materials for wafer level packages, fabrication processes, and board-level assemblies. An overview of emerging applications of present high-tech industry and future needs is given first as a background for understanding the evolution and progress of advanced WLP  (AWLP) technologies and package platforms, including latest industry metrology and inspection methodology, standards, and reliability reequirements .latest semiconductor technology challenges in SOC (Systen on Chip) and 3D TSV system integration solutions (SiP) are also discussed.
   本课程全面回顾并讨论HDAP WLP技术的进展,重点了解设计考虑、晶圆级封装材料、制造工艺和板级总成。首先概述当前高科技产业的新兴应用和未来需求,作为了解先进WLP先进的WLP(AWLP)技术和包装平台,包括最新的行业计量和检验方法、标准和可靠性要求技术演变和进步的背景。此外,还会讨论片上系统(SOC)和3D TSV系统集成解决方案(SiP)中的最新半导体技术挑战。
The advancement in various types of Fan-in and Fan-out WLP, necessary design tools, materials, processes, and supplychain strategies are provided in detail. Audience will have ample opportunities to ask questions and participate in discussions.
详细介绍各类扇入和扇出WLP、必要设计工具、材料、工艺和供应链策略方面的进展。听众将有足够的机会提问并参与讨论。
Who should attend 培训对象
   This course is intended for engineers and scientists in semicnonductor, microelectronics, and electronics industry who are interested in latest progress in advanced high-performance, high-density IC packaging technology and applications. Non-tehnical administratiors, technical sales and application enginers in IC packaging industry are also encouraged to attend.
   本课程面向半导体、微电子和电子行业的工程师和科学家,他们对先进的高性能、高密度集成电路封装技术和应用的最新进展感兴趣。同时也鼓励集成电路封装行业的非技术管理人员、技术销售和应用工程师参加。
Outline 本课程将涵盖以下主题
English 英文 Chinese 中文
1、Review of current world high-tech industry technology trend and needs: AI, Smart Manufacturing, IoT, Robotics, autonomous driving, 5G, smart home and cities 1、当前世界高科技产业技术趋势和需求综述:人工智能、智能制造、物联网、机器人、自动驾驶、5G、智能家居和城市
2、End of Moore’s Law in Semiconductor and system integration solutions: SOC, 3D IC integration approaches 2、半导体和系统集成解决方案中摩尔定律的终结:SOC、3D集成电路集成方法
3、Chip-package interaction (CPI) 3、芯片封装交互作用(CPI)
4、Evolution of area array package technology: BGA, CSP, and Flip Chip 4、面阵封装技术的发展:BGA、CSP和倒装芯片
5、Advent of high-density dvanced IC packaging (HDAP) as a solutions for More-than-Moore, Drivers for AWLP (Advanced Wafer Level Psackage) and FO-WLP (Fan-Out Wafer-Level Packaging) 5、高密度先进集成电路封装(HDAP)作为超越摩尔定律的解决方案出现,成为AWLP(先进的晶片级封装)先进和FO-WLP(扇出型晶圆级封装)的驱动因素
6、Wafer Processing: thinning, wafer bonding and wafer handling processes 6、晶圆处理:减薄、晶圆键合和晶圆处理工艺
7、Materials for various FOWLP platforms: Infineon eWLB, TMV PoP, INFO WLP/PoP, Amkor SWIFT, WLP mold compound, WLP RDL polymers, WLP underfill 7、用于各种FOWLP平台的材料:Infineon eWLB、TMV PoP、INFO WLP/PoP、Amkor SWIFT、WLP塑封材料、WLP RDL聚合物、WLP底层填料
8、Manufacturing process for FOWLP, die-first and RDL-first 8、FOWLP、模具优先和RDL优先的制造工艺
9、Panel level Package (PLP) progress 9、面板级封装(PLP)进展
10、System in Package (SiP) applications and functional modules integration for mobile and wearable devices, 5G, and automotives applications 10、面向移动式和可穿戴式设备、5G和汽车应用的系统级封装(SiP)应用和功能模块集成
11.Advanced metrology inspection technology, equipment, industry standards, and reliability requirements for AWLP 11、先进的计量检测技术、设备、行业标准和AWLP的可靠性要求
12、Industry and technology outlook and needs for HDAP and WLP 12、HDAP和WLP的行业和技术前景及需求
13、Summary, Questions and Answers 13、总结、问答环节
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